Equipment Mechanics of Materials and Nanostructures

Microanalysis/Chemical Analysis

  • Glow Discharge Optical Emission Spectrometer (GD-OES), JY RF-5000
  • X-Ray Diffractometer 2theta/theta, Bruker D8 Discover (Bragg Brentano and parallel beam setup, copper tube, Eulerian cradle)
    For Phase Identification, Grain Size, Grazing Incidence, X-Ray Reflectometry, Stress, Texture
  • X-Ray Fluorescence Spectrometer Fischerscope X-Ray XDV-SDD
  • Confocal Raman spectroscopy (NTEGRA Spectra from NT-MDT), Raman Mapping, Lasers: He-Ne (633 nm) and solid state (532 nm), Objectives : 10x, 50x, 100x, 250x, Spectral Resolution: <0.5 cm-1
  • Balance Mettler PM 2500 MultiRange with addition for densities
  • High spatial resolution gallium ion secondary ion mass spectrometer, integrated with Tescan Lyra focused ion beam instrument - see below
  • Contact and non-contact AFM, Phase Imaging, EFM/KFM, AFM and KFM Lithography, XYZ-scanning by sample (closed-loop)
  • Coupling AFM/Raman, XY-scanning by excitation laser beam (closed-loop)/Piezo-driven mirror for scanning the apex of the tip with the incident beam
  • Leica EMTIC3x Ionslicer
  • Leica EMCPD300 Critical Point Dryer
  • Leica EMACE600 Sputtlecoater (Gold, Carbon)
  • Leica EMTXP sample preparation

Transmission Electron Microscopy

FEI Titan Themis 200 (ThermoFisher)

  • X-FEG high brightness electron source
  • Cs DCOR Probe Corrector 200 kV
  • STEM imaging: High Angle Annular Dark Field detector (HAADF) with OptiSTEM software
  • Super-X EDX System
  • Ceta 16M Camera 200 kV with speed enhancement (4k x 4k STEM imaging with 40 fps; 512x512 with 320 fps)
  • CompuStage Single-tilt Holder; High-visibility Low-background Double-tilt Holder
  • Velox Analytical and Imaging softwares

Electron Microscopy/ FIB

High resolution cold field emission SEM Hitachi S-4800 (CFE)

  • STEM detector zu S-4800
  • EDX system EDAX Genesis 4000
  • EBSD DigiView II camera. EDAX OIM software (V5.3.1)
  • Hysitron Picoindenter

Large Chamber, variable pressure SEM Hitachi S-3600VP

  • • XENOS e-beam lithography software
    • external and internal gas injection system for direct patterning
    • high temperature stage
    • stage current monitoring
    • SEM compatible femtogram mass sensor

Large Chamber SEM, SEM Zeiss DSM96

  • Micro tensile stage for SEM and light microscope
  • Micro bending stage for SEM and light microscope, Kammrath und Weiss
  • home-made Microindenter
  • Heating stage

Tescan Lyra/XMU Dual beam FIB

  • YAG SE detector
  • Retractable annular scintillator type BSE (YAG Crystal)
  • Fully motorized stage
  • Variable pressure mode for SEM
  • 4-d Nanomanipulator using slip-stick piezos from SmarAct
  • Gas injection system using slip-stick piezos from SmarAct
  • Time-of-Flight Mass Spectrometry (TOFMS)

Tescan Lyra3/XMU FEG/FIB

  • YAG SE detector
  • Retractable annular scintillator type BSE (YAG Crystal)
  • Retractable CL Detector Panchromatic cathodoluminescence detector 185 nm – 850 nm
  • Fully motorized stage
  • Variable pressure mode for SEM
  • STEM Detector Transmitted electrons detector; Bright Field and Dark Field imaging
  • EBIC Electron beam induced current detection
  • Time-of-Flight Mass Spectrometry (TOFMS)
  • EBSD DigiView 5 camera. EDAX OIM software
  • EDS Octane Plus Silicon Detector (SDD). EDAX TEAM software
  • XRF IFG iMOXS-SEM with polycapillary mini-lens (Rh source)
  • Tuning fork AFM dedicated for measurements in vacuum (In-house build, in collaboration with Specs)

Philips XL30-FEG ESEM

  • Div detectors

Hitachi 3030Plus TableTop Electronmicroscope

Materials Mechanics and Nanomechanics

  • CSM Nanointenter (Vacuum high temperature)
  • MTS Nanoindenter XP (Indentation & Scratch & Mikrokompression)
  • CSEM Nanohardness & Nanoscratch Tester (Indentation & Scratch)
  • Micro tensile stage for SEM and light microscope, Kammrath und Weiss
  • Micro bending stage for SEM and light microscope, Kammrath und Weiss
  • home-made SEM Microindenter for SEM and light microscope
  • Hardness test instruments: Universal Hardness Zwick HU2,5, Vickers, Brinell


  • Autolab analytical potentiostats (including ac impedance module) and current booster (up to 20A)
  • Computer controlled 6 kW power source
  • Variety of electrochemical cells and reference electrodes
  • Rotating propeller MEMS plating cell and Hull cell
  • PH meter
    • Conductivity meter
    • Titration devices
    • CVS devices
    • Comsol FEM module plating/anodization
    • One glove box
    • Rapid Thermal annealing system


PVD chamber #1 (Mantis QPREP 500)

ALD-PVD multilayer adhesion studies without breaking the vacuum

Deposition techniques

  • Three inch magnetrons for sputtering with RF and DC power sources
  • E-beam assisted thermal evaporator with four independent pockets
  • Shutter system for gradient depositions or patches

Loadlock features

  • Chamber-in-chamber design with exhaust for ALD/CVD processes
  • Dual heaters up to 250C
  • Six precursor lines, currently configured for Al2O3 and ZnO

Main chamber features

  • Quartz crystal balance
  • Substrate stage heating to 800o C
  • Automated loadlock and sample transfer for multilayers
  • Secondary MFC for reactive sputtering


PVD chamber #2 (Mantis M 600)
Studying the effect of nanoparticles and pulsed DC plasma

NanoGen 50 Nanoparticle source

  • MesoQ quadrupole mass spectrometer for mass filtering and size control

One 2 inch and one 3 inch magnetron

  • 2x HiPIMS sputter sources, plus RF and DC
  • Adjustable magnetron distance for very high deposition rates
  • Custom magnet sets for plasma density control

Main chamber features

  • UHV design for plasma science
  • Viewports for optical inspection of plasma in transmission and reflection
  • Crygogenically cooled panels for extreme low base pressure
  • Substrate stage heating to 800o C
  • Loadlock for manual sample transfer
  • Secondary MFC for reactive sputtering

PVD chamber #3 (Polygnon Physics)

  • Novel mini ECR plasma sputter source
  • Up to 24 sources in simultaneous operation
  • Reactive sputtering possible


EMPA Cleanroom in Thun

Full LiGA mold and 2D/3D photoresist processing line


  • Class 10.000 or ISO 7
  • 35 m2 clean space and 10 m2 grey zone
  • Yellow light filtration for photosensitive materials
  • All exposure equipment interoperable at 365 nm (I-line)


  • Nanoscribe Photonic Professional GT
    Two-photon 3D lithography with resolution down 100 nm
  • Karl Süss MA-6
    4 inch contact aligner with 1 um resolution
  • IMP SF-100
    Fast prototyping maskless dot matrix printer with 15 um resolution
  • Full LiGA mold and 2D/3D photoresist processing line
    Various spincoaters and baking stations


PVD-ALD Cluster
  • The Mantis PVD chamber load lock was modified to contain an ALD chamber with 6 gas inlets to coat PVD nanoparticles and thin PVD layers without breaking the vacuum.
  • ALD load lock: 6 inch wafer, Materials: Oxide coatings, like Al2O3, ZnO, TiO2.
  • PVD: High vacuum chamber with a nanoparticle gun, e-beam evaporation and DC & RF magnetron sputtering. Materials: metals, nitrides, oxides, multilayers, combinatorial

Custom made stationary ALD reactor

  • 3 gas inlet lines. Temperatures up to 240°C. Al2O3, ZnO, TiO2, SiO2, CeO2, etc.

  • Modifiable to use O3 and O2 plasma

  • 4 inch wafer size, 3 cm thick samples

  • Full control over temperature and variable cycle/purge/exposure periods as function of total cycle number

  • Integrated novel Temperature Step ALD [C. Guerra, H.G. Park, I. Utke et al., Nanoscale (2015) DOI: 10.1039/c5nr02106e]

Mobile ALD

  • Autonomous and can be transported to any location as it is installed on a rack. It has a 3+ valve manifold line to connect to any reactor or characterization equipment for in-situ ALD measurements.
  • Reactors used so far: Flow through reactor for fast ALD on porous membranes and powders.

  • Mini reactor for in-situ Raman studies of initial ALD stage

Arradiance Benchtop ALD

  • This commercial system is designed in a compact way to allow for precursors with low vapour pressures to enable off-standard oxide, metal, and fluoride film materials. It is suitable for 6 inch wafers and heats to 300°C
  • Equipped with a  QCM it allows for in-situ control of initial growth during ALD as well as growth monitoring

  • It also features a glove box connection for ALD on moisture and air sensitive samples